SICK AG Integrates Aeva FMCW 4D LiDAR Technology for Industrial Sensing Applications

SICK AG has incorporated Aeva’s frequency modulated continuous wave (FMCW) 4D LiDAR technology into its industrial sensing product portfolio. This integration aims to provide high-precision sensing capabilities for factory automation and logistics applications, allowing SICK to utilize Aeva’s sensor-on-chip architecture to detect distance and velocity simultaneously.

The partnership combines SICK’s established industrial sensor infrastructure with Aeva’s proprietary LiDAR-on-chip technology. By adopting this sensing method, the new product line measures the instantaneous velocity of objects in addition to their three-dimensional position. This technical shift allows the sensors to distinguish between stationary and moving objects with greater accuracy in complex industrial environments. The companies intend for these sensors to support tasks such as autonomous mobile robot navigation, safety monitoring, and automated material handling within manufacturing facilities.

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Source: GO-AI-ne1

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Date: June 2, 2026

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GOAI